Alumina ceramic shaped parts

Zirconia Ceramic Robotic Arms and Semiconductor Wafer Handling Equipment Product Introduction:

1. Product Characteristics

• Material Performance: Made of high-purity zirconia ceramic material, it possesses high strength (compressive strength exceeding 2000 MPa), high hardness (Mohs hardness 8.5), high temperature resistance (maximum operating temperature 1600℃), and excellent wear resistance.

• Precision Machining: Through cold isostatic pressing, high-temperature sintering, and precision machining, the dimensional accuracy can reach ±0.001mm, and the surface finish reaches Ra0.1.

• Chemical Stability: It exhibits stability in acidic, alkaline, and organic solvent environments, is not prone to chemical reactions, and will not contaminate semiconductor components.

Application Fields

• Wafer handling in semiconductor manufacturing.

• Mechanical components in high-temperature environments.

• Joint parts of humanoid robots.

• Radiation shielding materials.

Semiconductor Wafer Handling Equipment

1. Vacuum Robot Arm:

• Working Environment: 10⁻⁵ Pa vacuum.

• Applicable Equipment: Photolithography machines, etching machines, etc.

• Technical Features: Uses direct-drive motors to avoid lubricant contamination.

2. Atmospheric Robot Arm:

• Cleanliness Level: Class 1-10.

• Market Share: Accounts for 60%.

• Technical Features: Adopts a sealed structure design.

3. Core Technologies:

• Material Selection: 95%-99% purity alumina ceramic (room temperature resistivity 10¹⁵ Ω·cm) or silicon carbide ceramic (thermal conductivity 490 W/m·K).

• Positioning Accuracy: Repeatable positioning accuracy ±0.05 mm, horizontal vibration 0.2g.

• Cleanliness Technology: Achieves the highest level of cleanliness (Class 1) in the ISO standard cleanroom classification.

Supports custom specifications.